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Dive into the research topics where Jae-Pil Jung is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
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Laser solder ball jetting of SAC305/ENIG joints: Microstructure, kinetics, and reliability under multiple reflow cycles
Ka, S., Bae, D., Sharma, A., Jung, J. P. & Kim, H. S., Feb 2026, In: Intermetallics. 189, 109098.Research output: Contribution to journal › Article › peer-review
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Advanced through-glass via (TGV) electro-filling and solder bumping for miniaturized 3D MEMS packaging
Jung, C. H., Jung, J. P., Sharma, A. & Kim, H. S., 20 Aug 2025, In: Journal of Alloys and Compounds. 1038, 182619.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
Effect of laser beam power on microstructure evolution and interface kinetics of laser-soldered mini-LEDs for MEMS packaging
Ku, J. H., Rajendran, S. H., Sharma, A., Jung, J. P. & Kim, H. S., Aug 2025, In: Journal of Materials Science: Materials in Electronics. 36, 22, 1410.Research output: Contribution to journal › Article › peer-review
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Low-melting and thermal-conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems
Kang, J., Sharma, A. & Jung, J. P., Apr 2025, In: Journal of Materials Science: Materials in Electronics. 36, 12, 693.Research output: Contribution to journal › Article › peer-review
7 Scopus citations -
Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding
Rajendran, S. H., Ku, J. H., Kang, J. & Jung, J. P., Mar 2024, In: Materials Today Communications. 38, 108250.Research output: Contribution to journal › Article › peer-review
5 Scopus citations