Calculated based on number of publications stored in Pure and citations from Scopus
1993 …2024

Research activity per year

Filter
Conference contribution

Search results

  • 2023

    Effect of Nanoparticle on Microstructure and Mechanical Properties of Aluminum Alloy for Vehicles

    Jung, J. P., Jung, D. H., Seo, S. M. & Rajendran, S. H., 2023, Proceedings of the 7th International Conference on Theoretical and Applied Nanoscience and Nanotechnology, TANN 2023. Avestia Publishing, (Proceedings of the International Conference of Theoretical and Applied Nanoscience and Nanotechnology; vol. 7).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    Open Access
  • 2022

    Ultrasonic dispersion of nanocomposite solder for microelectronic packaging

    Rajendran, S. H., Kang, H., Seo, S. M. & Jung, J. P., 2022, Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022. IEEE Computer Society, (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2022-October).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    1 Scopus citations
  • 2018

    Liquid metal embrittlement of resistance spot welded 1180trip steel

    Choi, D. Y., Lee, H., Sharma, A., Enloe, C. M. & Jung, J. P., 2018, International Automotive Body Congress, IABC 2018 DEARBORN. Global Automotive Management Council, (International Automotive Body Congress, IABC 2018 DEARBORN).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • Liquid metal embrittlement of resistance spot welded 1180 TRIP steel

    Choi, D. Y., Lee, H., Jung, J. P., Sharma, A. & Enloe, C. M., 2018, International Automotive Body Congress, IABC 2018 DEARBORN. Global Automotive Management Council, (International Automotive Body Congress, IABC 2018 DEARBORN).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • 2016

    Joint Properties and Thermomechanical Reliability of Nanoparticle-Added Sn-Ag-Cu Solder Paste

    Kim, K. H., Yoo, S., Yoon, J., Yim, S., Baek, B. G., Yoon, J. H., Jung, D. & Jung, J. P., 16 Aug 2016, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 1822-1826 5 p. 7545670. (Proceedings - Electronic Components and Technology Conference; vol. 2016-August).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    3 Scopus citations
  • 2015

    Zirconia nanoparticle reinforced Al-Si-cu alloy based composite for low temperature brazing applications

    Roh, M. H., Sharma, A., Lim, D. U. & Jung, J. P., 2015, Proceedings - TORONTO'2015 AES-ATEMA 25th International Conference on Advancesand Trends in Engineering Materials and their Applications, ATEMA TORONTO 2015. Haddad, Y. M. (ed.). Advanced Engineering Solutions, p. 77-84 8 p. (AES-ATEMA International Conference Series - Advances and Trends in Engineering Materials and their Applications; vol. 10-14-August-2015).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • 2010

    Characterizations of CW Nd:YAG laser soldering of lead free solder

    Kim, J. O., Lee, J. H., Suh, J., Kang, H. S. & Jung, J. P., 2010, Materials Science and Technology Conference and Exhibition 2010, MS and T'10. p. 2964-2971 8 p. (Materials Science and Technology Conference and Exhibition 2010, MS and T'10; vol. 4).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • 2008

    Bending fatigue characteristic of Sn-3.5Ag solder bump on Ni-UBM

    Kang, K. I., Jung, J. P., Bang, W. H., Park, J. H. & Oh, K. H., 2008, Materials Science Forum - Advanced Welding and Micro Joining/Packaging for the 21st Century - Selected peer reviewed papers from the International Welding/Joining Conference-Korea 2007, IWJC 2007. Lee, C. H., Lee, J.-B., Lee, J.-B., Park, D.-H. & Na, S.-J. (eds.). Trans Tech Publications Ltd., p. 177-182 6 p. (Materials Science Forum; vol. 580-582).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    1 Scopus citations
  • Effect of laser parameter on the bond characteristics of Sn-3.5%Ag solder ball

    Kim, J. O., Jung, J. P., Lee, J. H., Suh, J. & Kang, H. S., 2008, Materials Science Forum - Advanced Welding and Micro Joining/Packaging for the 21st Century - Selected peer reviewed papers from the International Welding/Joining Conference-Korea 2007, IWJC 2007. Lee, C. H., Lee, J.-B., Lee, J.-B., Park, D.-H. & Na, S.-J. (eds.). Trans Tech Publications Ltd., p. 191-196 6 p. (Materials Science Forum; vol. 580-582).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • 2005

    Experimental study of ultrasonic wedge bonding with copper wire

    Tian, Y. H., Lum, I., Won, S. J., Park, S. H., Jung, J. P., Mayer, M. & Zhou, Y., 2005, 2005 6th International Conference on Electronics Packaging Technology. IEEE Computer Society, p. 389-393 5 p. 1564641. (2005 6th International Conference on Electronics Packaging Technology; vol. 2005).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    12 Scopus citations
  • 2001

    Fluxless solder bumping in flip chip package by plasma reflow

    Hong, S. M., Kang, C. S. & Jung, J. P., 2001, Advances in Electronic Materials and Packaging 2001. Lee, S. B. & Paik, K. W. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 139-144 6 p. 983973. (Advances in Electronic Materials and Packaging 2001).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    3 Scopus citations
  • 1993

    Liquid phase diffusion bonding of Rene 80 superalloy using boron as an insert metal

    Jung, J. P., Kang, C. S. & Lee, Y., 1993, First International Conference on Processing Materials for Properties. Publ by Minerals, Metals & Materials Soc (TMS), p. 23-27 5 p. (First International Conference on Processing Materials for Properties).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review