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알루미늄 패드 두께와 팔라듐 함량에 따른 금 와이어 본딩의 고온신뢰성 연구

Translated title of the contribution: High-temperature Reliability of Gold Wire Bonding According to Aluminum Pad Thickness and Palladium Content
  • University of Seoul
  • MK Electron Co., Ltd.

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

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