A review on the fabrication and reliability of three-dimensional integration technologies for microelectronic packaging: Through-si-via and solder bumping process
- Do Hoon Cho
- , Seong Min Seo
- , Jang Baeg Kim
- , Sri Harini Rajendran
- , Jae Pil Jung
- University of Seoul
Research output: Contribution to journal › Review article › peer-review
71
Scopus
citations