Abstract
This letter presents an in-depth investigation of the channel profile and cell current analysis of abnormal vertical 3D NAND flash memory. By utilizing 3D (technology computer-aided design) TCAD simulation, the channel profile was designed with an oxide-nitride-oxide (O/N/O) structure, providing insights into its impact on device performance. The ID-VDS curve was measured after setting the Vth target in the program state, enabling the analysis of the cell current. Additionally, the E-field of the tunneling oxide was considered to gain a comprehensive understanding of the device behavior. Based on the analysis results, the structure most vulnerable to cell current in vertical 3D NAND flash memory has been identified.
Original language | English |
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Pages (from-to) | 138-143 |
Number of pages | 6 |
Journal | Journal of Semiconductor Technology and Science |
Volume | 24 |
Issue number | 2 |
DOIs | |
State | Published - Apr 2024 |
Keywords
- 3D NAND flash memory
- cell current
- channel profile
- electric field
- threshold voltage