TY - JOUR
T1 - Analysis of high speed shear characteristics of Sn-Ag-Cu solder joints
AU - Kumar, Santosh
AU - Park, Jae Yong
AU - Jung, Jae Pil
PY - 2011/12
Y1 - 2011/12
N2 - A high speed shear test for Sn-Ag-Cu(3. 0 wt %Sn and 0. 5 wt % Ag) solder has been studied by varying shearing rate, tip height and solder volume. Failure mode analysis of the solder joint revealed that ductile and brittle failure modes coexist when the shearingspeed is 500 mm/s or higher. The higher the shearing rate, the fewer the ductile failures and the more brittle or mixed failures have been observed. Tip height variation does not have astrong impact on failure mode, but occasions for pad lift appeared to be strongly related with tip height conditions. While the maximum shear force does not provide any indication of the failure mechanism, careful analysis of the force-displacement curves showed the potential of area related indices as a method to analyze the various failure modes.
AB - A high speed shear test for Sn-Ag-Cu(3. 0 wt %Sn and 0. 5 wt % Ag) solder has been studied by varying shearing rate, tip height and solder volume. Failure mode analysis of the solder joint revealed that ductile and brittle failure modes coexist when the shearingspeed is 500 mm/s or higher. The higher the shearing rate, the fewer the ductile failures and the more brittle or mixed failures have been observed. Tip height variation does not have astrong impact on failure mode, but occasions for pad lift appeared to be strongly related with tip height conditions. While the maximum shear force does not provide any indication of the failure mechanism, careful analysis of the force-displacement curves showed the potential of area related indices as a method to analyze the various failure modes.
KW - electronic materials
KW - high speed shear test
KW - mechanical properties
KW - scanning electron microscopy (SEM)
KW - soldering
UR - http://www.scopus.com/inward/record.url?scp=84862908771&partnerID=8YFLogxK
U2 - 10.1007/s13391-011-0160-5
DO - 10.1007/s13391-011-0160-5
M3 - Article
AN - SCOPUS:84862908771
SN - 1738-8090
VL - 7
SP - 365
EP - 373
JO - Electronic Materials Letters
JF - Electronic Materials Letters
IS - 4
ER -