Abstract
To analyze the withdrawal force curve in the wetting balance curve, wetting balance tests using the 63Sn-37Pb and 96.5Sn-3.6Ag eutectic solders were conducted by varying the immersion speed, sample perimeter, and solder temperature. The mechanism of the withdrawal force curve was reviewed and a new method for calculating the surface tension of solders using the withdrawal force curve was introduced. The results showed that the maximum point of the withdrawal force curve is generated when the sliding solder meets the bottom corners of a sample and the contact angle is reduced to zero. The maximum withdrawal force subtracted by end force can be expressed using force balance equation as F = pγ. Therefore, the surface tension of the solder can be calculated by dividing the maximum withdrawal force by the sample parameter.
| Original language | English |
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| Pages (from-to) | 1256-1262 |
| Number of pages | 7 |
| Journal | Journal of Electronic Materials |
| Volume | 28 |
| Issue number | 11 |
| DOIs | |
| State | Published - Nov 1999 |