TY - GEN
T1 - Analysis on self heating effects in nanowire FET considering effective thermal conductivity of BEOL
AU - Kim, Hyunsuk
AU - Son, Dokyun
AU - Myoung, Ilho
AU - Kang, Myounggon
AU - Shin, Hyungcheol
N1 - Publisher Copyright:
© 2017 JSAP.
PY - 2017/12/29
Y1 - 2017/12/29
N2 - Accurate evaluation of Self Heating Effects in highly down-scaled devices becomes essential for improved performance and reliability. However, complex structure of BEOL causes analysis of SHEs to be difficult To remove the difficulty, based on Rent's rule to obtain interconnect density function, effective thermal conductivity of BEOL versus metal volume density and average aspect ratio (p) was calculated. With results above, TCAD simulation for SHEs was performed in 5 nm node nanowire FET. As a result, lowered thermal conductivity by complicated structure can bring underestimated SHEs through simulation.
AB - Accurate evaluation of Self Heating Effects in highly down-scaled devices becomes essential for improved performance and reliability. However, complex structure of BEOL causes analysis of SHEs to be difficult To remove the difficulty, based on Rent's rule to obtain interconnect density function, effective thermal conductivity of BEOL versus metal volume density and average aspect ratio (p) was calculated. With results above, TCAD simulation for SHEs was performed in 5 nm node nanowire FET. As a result, lowered thermal conductivity by complicated structure can bring underestimated SHEs through simulation.
UR - http://www.scopus.com/inward/record.url?scp=85051065338&partnerID=8YFLogxK
U2 - 10.23919/SNW.2017.8242287
DO - 10.23919/SNW.2017.8242287
M3 - Conference contribution
AN - SCOPUS:85051065338
T3 - 2017 Silicon Nanoelectronics Workshop, SNW 2017
SP - 41
EP - 42
BT - 2017 Silicon Nanoelectronics Workshop, SNW 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd Silicon Nanoelectronics Workshop, SNW 2017
Y2 - 4 June 2017 through 5 June 2017
ER -