Skip to main navigation Skip to search Skip to main content

Application of linear annealing method to Si||SiO2/Si wafer direct bonding

  • Seoul National University
  • Hanyang University

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Fingerprint

Dive into the research topics of 'Application of linear annealing method to Si||SiO2/Si wafer direct bonding'. Together they form a unique fingerprint.
Sort by

Engineering