Application of TLP(Transient Liquid Phase) bonding method to the high Tm lead-free solder

J. S. Lee; W. H. Bang; J. P. Jung; K. H. Oh

doi:10.4028/0-87849-960-1.1869

Application of TLP(Transient Liquid Phase) bonding method to the high T_m lead-free solder

J. S. Lee, W. H. Bang, J. P. Jung, K. H. Oh

Department of Materials Science and Engineering

Research output: Contribution to journal › Conference article › peer-review

7 Scopus citations

Abstract

TLP method was applied to the lead free soldering process; Sn-3.5Ag core solder (T_m of 221°C) / Sn-Bi coating layer (T_m of 139°C at eutectic) was reflowed on UBM pad. Sn-Bi was formed by electroplating method at current range of 2-6A/dm², which had varied the coating layer composition from 96wt% to 28wt% Bi. Specimens were reflowed on copper pad at temperature range of 200 and 220°C, and then interface reaction was examined. It was claimed that high Bi adding in the plated layer improved the wetting performance on Cu. Even at the reflow temperature of 200°C, SEM observation revealed well-defined interface junctions between solder and copper pad, i.e. nucleation and growth of Cu_xSn intermetallic compound. After heating for 5min at 220°C, Bi was resolved into Sn-3.5Ag core solder and completely homogenized, which is favorable from the viewpoint of long term fatigue reliability.

Original language	English
Pages (from-to)	1869-1872
Number of pages	4
Journal	Materials Science Forum
Volume	475-479
Issue number	III
DOIs	https://doi.org/10.4028/0-87849-960-1.1869
State	Published - 2005
Event	PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing - Beijing, China Duration: 2 Nov 2004 → 5 Nov 2004

Keywords

Electroplating
Reflow
Soldering
TLP(Transient Liquid Phase) method

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10.4028/0-87849-960-1.1869

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@article{6ada566fbbb94233add81064b9b894f4,

title = "Application of TLP(Transient Liquid Phase) bonding method to the high Tm lead-free solder",

abstract = "TLP method was applied to the lead free soldering process; Sn-3.5Ag core solder (Tm of 221°C) / Sn-Bi coating layer (Tm of 139°C at eutectic) was reflowed on UBM pad. Sn-Bi was formed by electroplating method at current range of 2-6A/dm2, which had varied the coating layer composition from 96wt% to 28wt% Bi. Specimens were reflowed on copper pad at temperature range of 200 and 220°C, and then interface reaction was examined. It was claimed that high Bi adding in the plated layer improved the wetting performance on Cu. Even at the reflow temperature of 200°C, SEM observation revealed well-defined interface junctions between solder and copper pad, i.e. nucleation and growth of CuxSn intermetallic compound. After heating for 5min at 220°C, Bi was resolved into Sn-3.5Ag core solder and completely homogenized, which is favorable from the viewpoint of long term fatigue reliability.",

keywords = "Electroplating, Reflow, Soldering, TLP(Transient Liquid Phase) method",

author = "Lee, {J. S.} and Bang, {W. H.} and Jung, {J. P.} and Oh, {K. H.}",

year = "2005",

doi = "10.4028/0-87849-960-1.1869",

language = "English",

volume = "475-479",

pages = "1869--1872",

journal = "Materials Science Forum",

issn = "0255-5476",

publisher = "Trans Tech Publications Ltd.",

number = "III",

note = "PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing ; Conference date: 02-11-2004 Through 05-11-2004",

}

TY - JOUR

T1 - Application of TLP(Transient Liquid Phase) bonding method to the high Tm lead-free solder

AU - Lee, J. S.

AU - Bang, W. H.

AU - Jung, J. P.

AU - Oh, K. H.

PY - 2005

Y1 - 2005

N2 - TLP method was applied to the lead free soldering process; Sn-3.5Ag core solder (Tm of 221°C) / Sn-Bi coating layer (Tm of 139°C at eutectic) was reflowed on UBM pad. Sn-Bi was formed by electroplating method at current range of 2-6A/dm2, which had varied the coating layer composition from 96wt% to 28wt% Bi. Specimens were reflowed on copper pad at temperature range of 200 and 220°C, and then interface reaction was examined. It was claimed that high Bi adding in the plated layer improved the wetting performance on Cu. Even at the reflow temperature of 200°C, SEM observation revealed well-defined interface junctions between solder and copper pad, i.e. nucleation and growth of CuxSn intermetallic compound. After heating for 5min at 220°C, Bi was resolved into Sn-3.5Ag core solder and completely homogenized, which is favorable from the viewpoint of long term fatigue reliability.

AB - TLP method was applied to the lead free soldering process; Sn-3.5Ag core solder (Tm of 221°C) / Sn-Bi coating layer (Tm of 139°C at eutectic) was reflowed on UBM pad. Sn-Bi was formed by electroplating method at current range of 2-6A/dm2, which had varied the coating layer composition from 96wt% to 28wt% Bi. Specimens were reflowed on copper pad at temperature range of 200 and 220°C, and then interface reaction was examined. It was claimed that high Bi adding in the plated layer improved the wetting performance on Cu. Even at the reflow temperature of 200°C, SEM observation revealed well-defined interface junctions between solder and copper pad, i.e. nucleation and growth of CuxSn intermetallic compound. After heating for 5min at 220°C, Bi was resolved into Sn-3.5Ag core solder and completely homogenized, which is favorable from the viewpoint of long term fatigue reliability.

KW - Electroplating

KW - Reflow

KW - Soldering

KW - TLP(Transient Liquid Phase) method

UR - http://www.scopus.com/inward/record.url?scp=17044383821&partnerID=8YFLogxK

U2 - 10.4028/0-87849-960-1.1869

DO - 10.4028/0-87849-960-1.1869

M3 - Conference article

AN - SCOPUS:17044383821

SN - 0255-5476

VL - 475-479

SP - 1869

EP - 1872

JO - Materials Science Forum

JF - Materials Science Forum

IS - III

T2 - PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing

Y2 - 2 November 2004 through 5 November 2004

ER -

Application of TLP(Transient Liquid Phase) bonding method to the high T_m lead-free solder

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Keywords

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