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Bonding properties of 14K white-red gold alloy by diffusion bonding process
Jeongho Song
,
Ohsung Song
Department of Materials Science and Engineering
University of Seoul
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Engineering
Alloy
100%
Diffusion Bonding
100%
Bonding Process
100%
Shear Strength
66%
Field-Emission Scanning Electron Microscopy
66%
Vickers
66%
Torr
33%
Microstructure
33%
Energy Engineering
33%
Temperature
33%
Thickness
33%
Mapping
33%
Low-Temperature
33%
Intermetallics
33%
Defects
33%
Bonding Strength
33%
Mechanical Properties
33%
Applied Pressure
33%
Melting Point
33%
Micropore
33%
Solid Solution
33%
Diffusion Coefficient
33%
Material Science
Energy-Dispersive X-Ray Spectroscopy
100%
Gold Alloys
100%
Temperature
50%
Field Emission Scanning Electron Microscopy
50%
Shear Strength
50%
Microscopy
50%
White Gold
50%
Vickers Hardness
50%
Metal
25%
Microstructure
25%
Diffusivity
25%
Hardness
25%
Intermetallics
25%
Mechanical Strength
25%
Solid Solution
25%