TY - JOUR
T1 - Characteristics of electrical metal contact to monolayer WSe2
AU - Jung, Dae Hyun
AU - Kim, Sang il
AU - Kim, Tae Wan
N1 - Publisher Copyright:
© 2020
PY - 2021/2/1
Y1 - 2021/2/1
N2 - The extremely high contact resistance often observed in the interface between two-dimensional p-type transition-metal dichalcogenides and metal electrodes with a high work function, such as Ni, Au, and Pd, is usually correlated with poor device performance. Here, we report the quantitative contact resistance and the Schottky barrier height of chemical vapor deposition grown-monolayer tungsten diselenide (WSe2)-based field-effect transistors (FETs) with Au electrodes; these values are obtained by using the transmission line method and by analyzing the low-temperature transport properties, respectively. Back-gate monolayer WSe2 FETs with Au electrodes exhibit p-type behavior, with a mobility, on/off ratio, contact resistance, and Schottky barrier height of 0.2 cm2/V•s, 6×105, 0.495 MΩ·μm, and 38 meV, respectively.
AB - The extremely high contact resistance often observed in the interface between two-dimensional p-type transition-metal dichalcogenides and metal electrodes with a high work function, such as Ni, Au, and Pd, is usually correlated with poor device performance. Here, we report the quantitative contact resistance and the Schottky barrier height of chemical vapor deposition grown-monolayer tungsten diselenide (WSe2)-based field-effect transistors (FETs) with Au electrodes; these values are obtained by using the transmission line method and by analyzing the low-temperature transport properties, respectively. Back-gate monolayer WSe2 FETs with Au electrodes exhibit p-type behavior, with a mobility, on/off ratio, contact resistance, and Schottky barrier height of 0.2 cm2/V•s, 6×105, 0.495 MΩ·μm, and 38 meV, respectively.
KW - Contact resistance
KW - Field-effect transistor
KW - Schottky barrier heights
KW - Transition-metal dichalcogenides
KW - Tungsten diselenide
UR - http://www.scopus.com/inward/record.url?scp=85098951805&partnerID=8YFLogxK
U2 - 10.1016/j.tsf.2020.138508
DO - 10.1016/j.tsf.2020.138508
M3 - Article
AN - SCOPUS:85098951805
SN - 0040-6090
VL - 719
JO - Thin Solid Films
JF - Thin Solid Films
M1 - 138508
ER -