Characteristics of the high speed shear test for Sn-3.0wt.%Ag-0.5wt.%Cu Solder ball joints

Young Gon Lee, Hee Yul Lee, Jeong Tak Moon, Jai Hyun Park, Shin Sik Han, Jae Pil Jung

Research output: Contribution to journalArticlepeer-review

10 Scopus citations


The effects of shear speed and tip height on the high speed shear test of Sn-3.0wt.%Ag-0.5wt.%Cu ball joints were investigated. Solder balls of 450 μm in diameter were reflowed at 245 °C on a FR4 PCB (Printed Circuit Board) in order to obtain a sample for the high-speed shear test. The UBM was comprised of Cu/Ni/Au, and the shear speed and tip height varied from 0.5 to 3.0 m/s, and from 10 to 135 μm, respectively. According to the experimental results, faster shear speed enhanced the shear strength of the solder joints, regardless of the tip height. The fraction of ductile (solder) fracture decreased when the shearing speed was raised from 0.5 to 3.0 m/s. With an increasing tip height from 10 to 50 and 135 μm, the fracture mode changed from pad lift to mixed (ductile and brittle) and ductile fracture, respectively, while the shearing energy also increased in the same order. The shear energy had a proportional relationship with the fraction of the solder fracture.

Original languageEnglish
Pages (from-to)580-585
Number of pages6
JournalJournal of Korean Institute of Metals and Materials
Issue number9
StatePublished - Sep 2009


  • High speed shear test
  • Shear strength
  • Shearing speed
  • Shearing tip height
  • Solder ball


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