Characteristics of the high speed shear test for Sn-3.0wt.%Ag-0.5wt.%Cu Solder ball joints

Young Gon Lee, Hee Yul Lee, Jeong Tak Moon, Jai Hyun Park, Shin Sik Han, Jae Pil Jung

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Fingerprint

Dive into the research topics of 'Characteristics of the high speed shear test for Sn-3.0wt.%Ag-0.5wt.%Cu Solder ball joints'. Together they form a unique fingerprint.

Engineering

Material Science