Abstract
Electrical transport properties of our PECVD a-Si:H material has been improved by using hydrogen and/or helium dilution of silane and lower substrate temperature for deposition. For hydrogen-diluted material we have measured electron and hole mobilities approx.4 times larger, and μτ values 2-3 times higher than for our standard a-Si:H. The density of ionized dangling bonds (ND*) also showed a factor of 5-10 improvement. Due to its higher conductivity, the improved a-Si:H material is more suitable than conventional a-Si:H for TFT applications. However, it is difficult to make thick layers by H-dilution because of high internal stress. On the other hand, thick detectors can be made at a faster rate and lower stress by low temperature deposition with He-dilution and subsequent annealing. The internal stress, which causes substrate bending and delamination, was reduced by a factor of 4 to approx.90 MPa, while the electronic quality was kept as good as that of the standard material. By this technique 35 μm-thick n-i-p diodes were made without significant substrate bending, and the electronic properties, such as electron mobility and ionized dangling bond density, were suitable for detecting minimum ionizing particles.
| Original language | English |
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| Pages | 218-222 |
| Number of pages | 5 |
| State | Published - 1995 |
| Event | Proceedings of the 1994 Nuclear Science Symposium and Medical Imaging Conference. Part 1 (of 4) - Norfolk, VA, USA Duration: 30 Oct 1994 → 5 Nov 1994 |
Conference
| Conference | Proceedings of the 1994 Nuclear Science Symposium and Medical Imaging Conference. Part 1 (of 4) |
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| City | Norfolk, VA, USA |
| Period | 30/10/94 → 5/11/94 |