Abstract
In this paper, circuit level analysis of the high frequency and low noise performance of an RF CMOS device with Leff= 36 nm is performed using various layout schemes. By using the modeling methodology of interconnect metals and vias, it is found that the gate parasitic capacitance from the interconnects mainly affects the degradation of high frequency and noise performance. An optimized layout scheme is proposed to reduce the gate parasitic resistance and capacitance in this paper, and the proposed layout exhibits improved RF behaviors for fT , f MAX , and NFmin at 26 GHz up to 13%, 24%, and 18% compared with the reference layout scheme, respectively.
Original language | English |
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Article number | 7588068 |
Pages (from-to) | 4674-4677 |
Number of pages | 4 |
Journal | IEEE Transactions on Electron Devices |
Volume | 63 |
Issue number | 12 |
DOIs | |
State | Published - Dec 2016 |
Keywords
- fMAX and NFmin
- high frequency fT
- Layout
- RF CMOS