Abstract
In this study, we characterize Cu/SiN/SiO2/Si devices with different dopant concentrations in the silicon surface for use as synaptic devices in neuromorphic systems. We verified the device stack by transmission electron microscopy (TEM) and energy-dispersive X-ray spectroscopy (EDS). An abrupt change is observed in Cu/SiN/SiO2/p++-Si at positive SET and negative RESET values, where Cu diffusion is involved in the conducting path. On the other hand, abrupt SET and gradual RESET values are observed in Cu/SiN/SiO2/p++-Si at negative SET operation and positive RESET operation, when intrinsic resistive switching occurs in SiN. The Cu/SiN/SiO2/p+-Si device shows gradual bipolar resistive switching with negative SET and positive RESET. Lower current switching and more gradual switching is possible in the Cu/SiN/SiO2/p+-Si device due to the series resistance. Potentiation and depression of the Cu/SiN/SiO2/p+-Si device can be more accurately controlled by pulses than is the case for the Cu/SiN/SiO2/p++-Si device. Moreover, we reveal that the Cu/SiN/SiO2/p+-Si device is more suitable for use as a synaptic device than the Cu/SiN/SiO2/p++-Si device according to the MNIST pattern recognition test.
Original language | English |
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Article number | 150101 |
Journal | Applied Surface Science |
Volume | 563 |
DOIs | |
State | Published - 15 Oct 2021 |
Keywords
- Metal-insulator-semiconductor
- Neuromorphic simulation
- Resistive switching
- Silicon nitride
- Synaptic device