Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints (Journal of Materials Science: Materials in Electronics, (2022), 33, 7, (3687-3710), 10.1007/s10854-021-07562-2)

Sri Harini Rajendran; Do Hyun Jung; Jae Pil Jung

doi:10.1007/s10854-022-08179-9

Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints (Journal of Materials Science: Materials in Electronics, (2022), 33, 7, (3687-3710), 10.1007/s10854-021-07562-2)

Sri Harini Rajendran, Do Hyun Jung, Jae Pil Jung

Department of Materials Science and Engineering

Research output: Contribution to journal › Comment/debate

Abstract

In the original version of this article, the affiliation details for Do Hyun Jung were incorrectly given. It should have been ‘‘Department of Materials Science and Engineering, University of Seoul, 163 Seoulsiripdaero, Dongdaemun-gu, Seoul 02504, Korea’’ and ‘‘Lightweight New Materials Technology Center, Gyeongbuk Technopark, Yeongju 36040, Korea’’. This has been corrected by publishing this correction article.

Original language	English
Pages (from-to)	11624
Number of pages	1
Journal	Journal of Materials Science: Materials in Electronics
Volume	33
Issue number	14
DOIs	https://doi.org/10.1007/s10854-022-08179-9
State	Published - May 2022

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Rajendran, S. H., Jung, D. H., & Jung, J. P. (2022). Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints (Journal of Materials Science: Materials in Electronics, (2022), 33, 7, (3687-3710), 10.1007/s10854-021-07562-2). Journal of Materials Science: Materials in Electronics, 33(14), 11624. https://doi.org/10.1007/s10854-022-08179-9

Rajendran, Sri Harini ; Jung, Do Hyun ; Jung, Jae Pil. / Correction to : Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints (Journal of Materials Science: Materials in Electronics, (2022), 33, 7, (3687-3710), 10.1007/s10854-021-07562-2). In: Journal of Materials Science: Materials in Electronics. 2022 ; Vol. 33, No. 14. pp. 11624.

@article{5b5e2ce69fd24cb39ef5b97fdd0d48cd,

title = "Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints (Journal of Materials Science: Materials in Electronics, (2022), 33, 7, (3687-3710), 10.1007/s10854-021-07562-2)",

abstract = "In the original version of this article, the affiliation details for Do Hyun Jung were incorrectly given. It should have been {\textquoteleft}{\textquoteleft}Department of Materials Science and Engineering, University of Seoul, 163 Seoulsiripdaero, Dongdaemun-gu, Seoul 02504, Korea{\textquoteright}{\textquoteright} and {\textquoteleft}{\textquoteleft}Lightweight New Materials Technology Center, Gyeongbuk Technopark, Yeongju 36040, Korea{\textquoteright}{\textquoteright}. This has been corrected by publishing this correction article.",

author = "Rajendran, {Sri Harini} and Jung, {Do Hyun} and Jung, {Jae Pil}",

note = "Publisher Copyright: {\textcopyright} Springer Science+Business Media, LLC, part of Springer Nature 2022.",

year = "2022",

month = may,

doi = "10.1007/s10854-022-08179-9",

language = "English",

volume = "33",

pages = "11624",

journal = "Journal of Materials Science: Materials in Electronics",

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Rajendran, SH, Jung, DH & Jung, JP 2022, 'Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints (Journal of Materials Science: Materials in Electronics, (2022), 33, 7, (3687-3710), 10.1007/s10854-021-07562-2)', Journal of Materials Science: Materials in Electronics, vol. 33, no. 14, pp. 11624. https://doi.org/10.1007/s10854-022-08179-9

Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints (Journal of Materials Science: Materials in Electronics, (2022), 33, 7, (3687-3710), 10.1007/s10854-021-07562-2). / Rajendran, Sri Harini; Jung, Do Hyun; Jung, Jae Pil.
In: Journal of Materials Science: Materials in Electronics, Vol. 33, No. 14, 05.2022, p. 11624.

Research output: Contribution to journal › Comment/debate

TY - JOUR

T1 - Correction to

T2 - Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints (Journal of Materials Science: Materials in Electronics, (2022), 33, 7, (3687-3710), 10.1007/s10854-021-07562-2)

AU - Rajendran, Sri Harini

AU - Jung, Do Hyun

AU - Jung, Jae Pil

PY - 2022/5

Y1 - 2022/5

N2 - In the original version of this article, the affiliation details for Do Hyun Jung were incorrectly given. It should have been ‘‘Department of Materials Science and Engineering, University of Seoul, 163 Seoulsiripdaero, Dongdaemun-gu, Seoul 02504, Korea’’ and ‘‘Lightweight New Materials Technology Center, Gyeongbuk Technopark, Yeongju 36040, Korea’’. This has been corrected by publishing this correction article.

AB - In the original version of this article, the affiliation details for Do Hyun Jung were incorrectly given. It should have been ‘‘Department of Materials Science and Engineering, University of Seoul, 163 Seoulsiripdaero, Dongdaemun-gu, Seoul 02504, Korea’’ and ‘‘Lightweight New Materials Technology Center, Gyeongbuk Technopark, Yeongju 36040, Korea’’. This has been corrected by publishing this correction article.

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U2 - 10.1007/s10854-022-08179-9

DO - 10.1007/s10854-022-08179-9

M3 - Comment/debate

AN - SCOPUS:85128048007

SN - 0957-4522

VL - 33

SP - 11624

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

IS - 14

ER -

Rajendran SH, Jung DH, Jung JP. Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints (Journal of Materials Science: Materials in Electronics, (2022), 33, 7, (3687-3710), 10.1007/s10854-021-07562-2). Journal of Materials Science: Materials in Electronics. 2022 May;33(14):11624. doi: 10.1007/s10854-022-08179-9

Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints (Journal of Materials Science: Materials in Electronics, (2022), 33, 7, (3687-3710), 10.1007/s10854-021-07562-2)

Abstract

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