Skip to main navigation Skip to search Skip to main content

Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints (Journal of Materials Science: Materials in Electronics, (2022), 33, 7, (3687-3710), 10.1007/s10854-021-07562-2)

  • University of Seoul
  • Lightweight New Materials Technology Center

Research output: Contribution to journal › Comment/debate

Fingerprint

Dive into the research topics of 'Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints (Journal of Materials Science: Materials in Electronics, (2022), 33, 7, (3687-3710), 10.1007/s10854-021-07562-2)'. Together they form a unique fingerprint.
Sort by

Material Science