Creep behavior of a poled PZT wafer under longitudinal tensile stress and through thickness electric field

Engineering

• Thickness 100%
• Electric Field 100%
• Tensile Stress σ 100%
• Thickness Direction 66%
• Experiments 33%
• Strain 33%
• Mechanisms 33%
• Environment 33%
• Creep 33%
• Boundary Condition 33%
• Internal Electric Field 33%
• Circuit Condition 33%
• Short Circuit 33%
• Open Circuit 33%