Creep behavior of a PZT wafer under tensile stress: Experiments and modeling

Engineering

• Experiments 100%
• Tensile Stress σ 100%
• Thickness Direction 100%
• Models 50%
• Energy Engineering 50%
• Mechanisms 50%
• Prediction 50%
• Boundary Condition 50%
• Internal Electric Field 50%
• Circuit Condition 50%
• Short Circuit 50%
• Open Circuit 50%