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Cu 도핑 및 Electric Current Pulse 공정에 의한 Bi-Sb-Te계 열전소재의 최대 열전성능지수 예측
Joonha Lee, Hyunjin Park, Junsu Kim, Won Seon Seo, Sang Il Kim, Hyun Sik Kim
Research output: Contribution to journal › Article › peer-review