@inproceedings{00b11612b1f44a518050773bec9eca63,
title = "Current stressing effects on the reliability of Cu pillar bump with shallow solder",
abstract = "The intermetallic compound (IMC) growths of Cu pillar bump with shallow solder (thin Sn thickness) were investigated during annealing or current stressing condition. After reflow, only Cu6Sn5 was observed, but Cu3Sn formed and grew at Cu pillar/Cu 6Sn5 interface with increasing annealing and current stressing time. The kinetics of IMC growth changed when all Sn in Cu pillar bump was exhausted. The complete consumption time of Sn phase in electromigration condition was faster than that in annealing condition. Under current stressing condition, intermetallic compound growth was significantly enhanced mainly due to the joule heating effects. Kirkendall void was observed at the interface of Cu pillar/Cu3Sn and it affected the mechanical reliability of Cu pillar bumps, which was estimated by die shear test.",
author = "Kim, {Byoung Joon} and Jeong, {Myeong Hyeok} and Kim, {Jae Won} and Kiwook Lee and Jaedong Kim and Park, {Young Bae} and Ohsung Song and Joo, {Young Chang}",
year = "2010",
doi = "10.1109/IPFA.2010.5532241",
language = "English",
isbn = "9781424455973",
series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",
booktitle = "IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits",
note = "17th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2010 ; Conference date: 05-07-2010 Through 09-07-2010",
}