Current stressing effects on the reliability of Cu pillar bump with shallow solder

Byoung Joon Kim, Myeong Hyeok Jeong, Jae Won Kim, Kiwook Lee, Jaedong Kim, Young Bae Park, Ohsung Song, Young Chang Joo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Fingerprint

Dive into the research topics of 'Current stressing effects on the reliability of Cu pillar bump with shallow solder'. Together they form a unique fingerprint.

Engineering

Material Science

Chemical Engineering

Food Science