Current stressing effects on the reliability of Cu pillar bump with shallow solder

  • Byoung Joon Kim
  • , Myeong Hyeok Jeong
  • , Jae Won Kim
  • , Kiwook Lee
  • , Jaedong Kim
  • , Young Bae Park
  • , Ohsung Song
  • , Young Chang Joo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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