Effect of 0D and 1D ZnO nano additive reinforced Sn-3.0Ag-0.5Cu solder paste on InGaN LED chip/ENIG joints

Sri Harini Rajendran, Seong Min Seo, Jae Pil Jung

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

Nanocomposite solder has been recognized as an excellent strategy to improve the reliability of solder joints. This study attempts to find the effects of ZnO nanoparticles (NP) and nanowires (NW), on the LED/Sn3.0Ag0.5Cu joint reliability. Varying amounts of ZnO NP and NW are dispersed into solder using a high-speed centrifugal paste mixer and LED/solder joints were assembled via paste printing and reflow technique. Until 0.2 wt %, adding NP and NW improved the spreading ratio of SAC 305 paste by 8.7 % and 11.1 %. However, due to ceramic/metal surface instability, higher addition declined the spreading ratio. Both NP and NW suppressed the (Cu, Ni)6Sn5 intermetallic compound (IMC) formed at the LED/solder joint. Dispersion strengthening provided by NP and NW improved the joint shear strength by 28.2 % and 31.1 %, respectively. The Weibull modulus and 75 % survival probability improved consistently with increasing ZnO NW addition, displaying homogeneity in shear strength and reliable LED/solder joints.

Original languageEnglish
Article number105795
JournalMaterials Today Communications
Volume35
DOIs
StatePublished - Jun 2023

Keywords

  • Shear strength
  • Sn3.0Ag0.5Cu (SAC 305)
  • Spreading ratio
  • Weibull analysis
  • ZnO nanowires

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