Effect of aluminium additions on wettability and intermetallic compound (IMC) growth of lead free Sn (2 wt. % Ag, 5 wt. % Bi) soldered joints

Hee Yul Lee, Ashutosh Sharma, Se Ho Kee, Young Woo Lee, Jung Tak Moon, Jae Pil Jung

Research output: Contribution to journal › Article › peer-review

32 Scopus citations

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