Effect of atomic hydrogen in SiN x films for gate dielectric of silicon-based TFTs fabricated at a low-temperature(≤150 °C) by Cat-CVD

Ki Su Keum, Kyoung Min Lee, Jae Dam Hwang, Kil Sun No, Wan Shick Hong

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

We studied the effect of in-situ hydrogen annealing on dielectric SiNx films at a low-temperature (150°C) by Cat-CVD. The in-situ hydrogen annealing was performed without a vacuum breaking. After in-situ annealing, furnace annealing was performed for 2hours below 150°C. The C-V, and I-V characteristics were measured by MIS structure. The high hydrogen ratio sample showed better dielectric properties improvement by annealing. SiNx films dielectric properties were extremely improved by insitu hydrogen annealing and furnace annealing. Breakdown field was 6 MV/cm. C-V hysteresis window was reduced from 15 V to 1 V. The on/off ratio of TFT was 105. The Mobility was 0.23. We successfully fabricated dielectric SiNx films at the low temperature, and also a-Si TFTs at the same temperature by Cat-CVD.

Original languageEnglish
Title of host publicationStudent Posters (General) - 219th ECS Meeting
Pages73-76
Number of pages4
Edition31
DOIs
StatePublished - 2011
EventGeneral Student Poster Session - 219th ECS Meeting - Montreal, QC, Canada
Duration: 1 May 20116 May 2011

Publication series

NameECS Transactions
Number31
Volume35
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceGeneral Student Poster Session - 219th ECS Meeting
Country/TerritoryCanada
CityMontreal, QC
Period1/05/116/05/11

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