Effect of atomic in-situ hydrogen annealing for gate dielectric cat-CVD silicon nitride films on flexible substrate at temperature below 200 °C

Ki Su Keum, Kyoung Min Lee, Jae Dam Hwang, Youn Jin Lee, Kil Sun No, Wan Shick Hong

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

We fabricated silicon-based bottom gate thin film transistors (TFTs) at low temperature (≤ 200 °C) by catalytic chemical vapor deposition (Cat-CVD) system. Tri-layer, silicon nitride (SiNx), nano-crystalline silicon (nc-Si), and n+-silicon (n+-Si), of TFTs were deposited continuously without vacuum breaking. To improve an on/off ratio of TFTs, we attempted to in-situ annealing on SiNx gate dielectric layer at atomic hydrogen (H2) atmosphere. The in-situ H2 annealing was performed before deposition nc-Si channel layer. As a result, we achieve the on/off ratio more than 105.

Original languageEnglish
Title of host publication10th International Meeting on Information Display and International Display Manufacturing Conference and Asia Display 2010, IMID/IDMC/ASIA Display 2010
Pages502-503
Number of pages2
StatePublished - 2010
Event10th International Meeting on Information Display and International Display Manufacturing Conference and Asia Display 2010, IMID/IDMC/ASIA Display 2010 - Seoul, Korea, Republic of
Duration: 11 Oct 201015 Oct 2010

Publication series

NameProceedings of International Meeting on Information Display
ISSN (Print)1738-7558

Conference

Conference10th International Meeting on Information Display and International Display Manufacturing Conference and Asia Display 2010, IMID/IDMC/ASIA Display 2010
Country/TerritoryKorea, Republic of
CitySeoul
Period11/10/1015/10/10

Keywords

  • Annealing
  • Dielectric
  • Flexible
  • Silicon nitride

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