Effect of laser parameter on the bond characteristics of Sn-3.5%Ag solder ball

Jeng O. Kim, Jae Pil Jung, Jae Hoon Lee, Jeong Suh, Hee Shin Kang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review


Pulsed Nd;YAG laser was applied to investigate the bond characteristics of Sn-3.5wt%Ag (hereafter, Sn-3.5Ag) solder ball. The ball diameter is 500μm, and the UBM (Under Bump Metallurgy) on a FR4-PCB consisted of Cu/Ni/Au from bottom to top with thickness of 50μm/25μm/0.05μm, respectively. A RMA (rosin mildly activated) flux for BGA (Ball Grid Array) was applied before laser soldering to set up the solder ball on the UBM. Laser power was 250W, and its beam diameter at the focal point was around 250μm. Experimental results reveal that the solder ball showed a good bonded state when the laser energy was in the range between 0.8 and 1.0 J. Laser energy lower than 0.8J caused non-wetting of the solder ball, and energy higher than 1.2J showed crack along the UBM. Microstructure of the laser soldered Sn-3.5Ag was examined with the number of pulse, when the frequency, pulse width and laser energy were fixed at 5 Hz, 20 ms and 0.8 J, respectively. The IMC (Intermetallic Compound) of Ag 3Sn in the solder changed from acicular to rod type with increasing laser pulses. Ni3Sn4 was produced between the solder and the UBM, and its thickness increased from 0.65 to 1.80μm with increasing number of pulse from 2 to 4. These are thinner than those of general air reflow. Shear strength of the laser soldered ball with output energy of 1 J showed 652.3 gf, and it was similar value compared to the result from hot plate soldering, 654.5 gf.

Original languageEnglish
Title of host publicationMaterials Science Forum - Advanced Welding and Micro Joining/Packaging for the 21st Century - Selected peer reviewed papers from the International Welding/Joining Conference-Korea 2007, IWJC 2007
EditorsChang Hee Lee, Jong-Bong Lee, Jong-Bong Lee, Dong-Hwan Park, Suck-Joo Na
PublisherTrans Tech Publications Ltd.
Number of pages6
ISBN (Electronic)9780878493609
StatePublished - 2008
EventInternational Welding/Joining Conference-Korea 2007, IWJC 2007 - Seoul, Korea, Republic of
Duration: 10 May 200712 May 2007

Publication series

NameMaterials Science Forum
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752


ConferenceInternational Welding/Joining Conference-Korea 2007, IWJC 2007
Country/TerritoryKorea, Republic of


  • Lead free solder
  • Microstructure
  • Nd;YAG laser
  • Reliability
  • Sn-3.5wt%Ag


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