Effect of Sn content on filler and bonding characteristics of active metal brazed Cu/Al2O3 joint

Jioh Shin; Ashutosh Sharma; Do Hyun Jung; Jae Pil Jung

doi:10.3365/KJMM.2018.56.5.366

Effect of Sn content on filler and bonding characteristics of active metal brazed Cu/Al₂O₃ joint

Jioh Shin, Ashutosh Sharma, Do Hyun Jung, Jae Pil Jung

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

This study examined the effects of the Sn content in a pure active metal filler Ag-Cu-Ti for the brazing of a Cu/Al₂O₃ joint. The optimal content of Sn to effectively wet alumina was 5 wt%. The microstructure of the brazed joint showed the presence of an Ag-rich matrix and a Cu-rich phase, and Cu-Ti intermetallic compounds were observed along the bonded interface. The intermetallic compounds (IMCs) in the filler are found to increase when the Sn content in the alloy approaches to 10 wt%. These results suggest an extremely significant bonding strength of Cu/Al₂O₃ joint using the Ag-Cu-Ti+Sn filler. The shear strength of the brazed joint increased with Sn content up to 5 wt%, reaching a maximum at ≈15 MPa. In addition, the strength decreased when the Sn content was higher than 5 wt%.

Original language	English
Pages (from-to)	366-374
Number of pages	9
Journal	Journal of Korean Institute of Metals and Materials
Volume	56
Issue number	5
DOIs	https://doi.org/10.3365/KJMM.2018.56.5.366
State	Published - May 2018

Keywords

Active brazing
Alumina
Diffusion
Intermetallic compounds
Metal

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title = "Effect of Sn content on filler and bonding characteristics of active metal brazed Cu/Al2O3 joint",

abstract = "This study examined the effects of the Sn content in a pure active metal filler Ag-Cu-Ti for the brazing of a Cu/Al2O3 joint. The optimal content of Sn to effectively wet alumina was 5 wt%. The microstructure of the brazed joint showed the presence of an Ag-rich matrix and a Cu-rich phase, and Cu-Ti intermetallic compounds were observed along the bonded interface. The intermetallic compounds (IMCs) in the filler are found to increase when the Sn content in the alloy approaches to 10 wt%. These results suggest an extremely significant bonding strength of Cu/Al2O3 joint using the Ag-Cu-Ti+Sn filler. The shear strength of the brazed joint increased with Sn content up to 5 wt%, reaching a maximum at ≈15 MPa. In addition, the strength decreased when the Sn content was higher than 5 wt%.",

keywords = "Active brazing, Alumina, Diffusion, Intermetallic compounds, Metal",

author = "Jioh Shin and Ashutosh Sharma and Jung, {Do Hyun} and Jung, {Jae Pil}",

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year = "2018",

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AU - Shin, Jioh

AU - Sharma, Ashutosh

AU - Jung, Do Hyun

AU - Jung, Jae Pil

PY - 2018/5

Y1 - 2018/5

N2 - This study examined the effects of the Sn content in a pure active metal filler Ag-Cu-Ti for the brazing of a Cu/Al2O3 joint. The optimal content of Sn to effectively wet alumina was 5 wt%. The microstructure of the brazed joint showed the presence of an Ag-rich matrix and a Cu-rich phase, and Cu-Ti intermetallic compounds were observed along the bonded interface. The intermetallic compounds (IMCs) in the filler are found to increase when the Sn content in the alloy approaches to 10 wt%. These results suggest an extremely significant bonding strength of Cu/Al2O3 joint using the Ag-Cu-Ti+Sn filler. The shear strength of the brazed joint increased with Sn content up to 5 wt%, reaching a maximum at ≈15 MPa. In addition, the strength decreased when the Sn content was higher than 5 wt%.

AB - This study examined the effects of the Sn content in a pure active metal filler Ag-Cu-Ti for the brazing of a Cu/Al2O3 joint. The optimal content of Sn to effectively wet alumina was 5 wt%. The microstructure of the brazed joint showed the presence of an Ag-rich matrix and a Cu-rich phase, and Cu-Ti intermetallic compounds were observed along the bonded interface. The intermetallic compounds (IMCs) in the filler are found to increase when the Sn content in the alloy approaches to 10 wt%. These results suggest an extremely significant bonding strength of Cu/Al2O3 joint using the Ag-Cu-Ti+Sn filler. The shear strength of the brazed joint increased with Sn content up to 5 wt%, reaching a maximum at ≈15 MPa. In addition, the strength decreased when the Sn content was higher than 5 wt%.

KW - Active brazing

KW - Alumina

KW - Diffusion

KW - Intermetallic compounds

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ER -

Effect of Sn content on filler and bonding characteristics of active metal brazed Cu/Al₂O₃ joint

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Keywords

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