Effect of soldering temperature on wetting and optical density of dip coated Sn and Sn-3.5Ag solders

Zengfeng Xu; Ashutosh Sharma; Soon Jae Lee; Jae Pil Jung

doi:10.1080/10426914.2014.952035

Effect of soldering temperature on wetting and optical density of dip coated Sn and Sn-3.5Ag solders

Zengfeng Xu, Ashutosh Sharma, Soon Jae Lee, Jae Pil Jung

Department of Materials Science and Engineering

University of Seoul

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

Abstract

The effects of soldering temperature on wetting characteristics and optical density of dip coated Sn and Sn-3.5Ag solders on Cu substrate were investigated. The wettability of solders was assessed by the wetting balance tester. The temperature of the solder bath varied in the range of 250-300°C. With the increase in temperature, a slight decrease in the surface tension of solders was noticed. The wetting tests demonstrated an increased solderability of pure Sn with temperature compared to Sn-3.5Ag solder. The optimum solderability of each solder was obtained at 270°C. The optical density of both the solders was also found to be highest at 270°C. It is reported that wettability and optical density of a solder are related to each other and can be tailored by varying the soldering temperature.

Original language	English
Pages (from-to)	127-132
Number of pages	6
Journal	Materials and Manufacturing Processes
Volume	30
Issue number	1
DOIs	https://doi.org/10.1080/10426914.2014.952035
State	Published - 2 Jan 2015

Keywords

Coatings
Deposition
Films
Joining
Melting
Optical
Silver
Soldering

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10.1080/10426914.2014.952035

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title = "Effect of soldering temperature on wetting and optical density of dip coated Sn and Sn-3.5Ag solders",

abstract = "The effects of soldering temperature on wetting characteristics and optical density of dip coated Sn and Sn-3.5Ag solders on Cu substrate were investigated. The wettability of solders was assessed by the wetting balance tester. The temperature of the solder bath varied in the range of 250-300°C. With the increase in temperature, a slight decrease in the surface tension of solders was noticed. The wetting tests demonstrated an increased solderability of pure Sn with temperature compared to Sn-3.5Ag solder. The optimum solderability of each solder was obtained at 270°C. The optical density of both the solders was also found to be highest at 270°C. It is reported that wettability and optical density of a solder are related to each other and can be tailored by varying the soldering temperature.",

keywords = "Coatings, Deposition, Films, Joining, Melting, Optical, Silver, Soldering",

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AB - The effects of soldering temperature on wetting characteristics and optical density of dip coated Sn and Sn-3.5Ag solders on Cu substrate were investigated. The wettability of solders was assessed by the wetting balance tester. The temperature of the solder bath varied in the range of 250-300°C. With the increase in temperature, a slight decrease in the surface tension of solders was noticed. The wetting tests demonstrated an increased solderability of pure Sn with temperature compared to Sn-3.5Ag solder. The optimum solderability of each solder was obtained at 270°C. The optical density of both the solders was also found to be highest at 270°C. It is reported that wettability and optical density of a solder are related to each other and can be tailored by varying the soldering temperature.

KW - Coatings

KW - Deposition

KW - Films

KW - Joining

KW - Melting

KW - Optical

KW - Silver

KW - Soldering

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Effect of soldering temperature on wetting and optical density of dip coated Sn and Sn-3.5Ag solders

Abstract

Keywords

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