Electrodeposition of the Sn-58 wt.%Bi layer for low-temperature soldering

Young Gon Lee, Jun Gyu Park, Chang Woo Lee, Jae Pil Jung

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26 Scopus citations


The electroplating characteristics and deposition layer of a Sn-Bi eutectic alloy applicable to low-temperature soldering were investigated. A methane sulphonate electrolyte was fabricated and the current density was focused in order to achieve an eutectic Sn-Bi composition. The electroplating characteristics, including the polarization curve and deposition thickness with plating time, were also studied. As experimental results, a polarization curve showed a Sn-Bi codeposition occurred under a -0.5 V electropotential. The Bi content in the Sn-Bi deposit decreased with an increasing current density, such as 99.42 wt.% for -10 mA/cm2 and 42.27 wt.% for -40 mA/cm 2. The thickness of the electroplated layer increased with the plating time, while a relatively uniform thickness was obtained in a short plating time, such as less than 40 min. The eutectic deposition of Sn-58.2 wt.%Bi was successfully fabricated by plating at -30 mA/cm2 for 30 min.

Original languageEnglish
Pages (from-to)117-121
Number of pages5
JournalMetals and Materials International
Issue number1
StatePublished - Feb 2011


  • Electrochemistry
  • Electronic materials
  • Plating
  • Scanning electron microscopy (SEM)
  • Sn-Bi eutectic alloy


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