Erratum: Ambient temperature ultrasonic bonding of Si-dice using Sn-3.5wt.%Ag (Journal of Electronic Materials (March 2008) 37:3 DOI: 10.1007/s11664-007-0341-z)

Jung Mo Kim, Jae Pil Jung, Y. Norman Zhou, Jong Hyeong Kim

Research output: Contribution to journalComment/debate

Original languageEnglish
Pages (from-to)1163
Number of pages1
JournalJournal of Electronic Materials
Issue number8
StatePublished - Aug 2008

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