Erratum: Ambient temperature ultrasonic bonding of Si-dice using Sn-3.5wt.%Ag (Journal of Electronic Materials (March 2008) 37:3 DOI: 10.1007/s11664-007-0341-z)

Jung Mo Kim; Jae Pil Jung; Y. Norman Zhou; Jong Hyeong Kim

doi:10.1007/s11664-008-0488-2

Erratum: Ambient temperature ultrasonic bonding of Si-dice using Sn-3.5wt.%Ag (Journal of Electronic Materials (March 2008) 37:3 DOI: 10.1007/s11664-007-0341-z)

Jung Mo Kim, Jae Pil Jung, Y. Norman Zhou, Jong Hyeong Kim

Department of Materials Science and Engineering

Research output: Contribution to journal › Comment/debate

Original language	English
Pages (from-to)	1163
Number of pages	1
Journal	Journal of Electronic Materials
Volume	37
Issue number	8
DOIs	https://doi.org/10.1007/s11664-008-0488-2
State	Published - Aug 2008

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10.1007/s11664-008-0488-2

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title = "Erratum: Ambient temperature ultrasonic bonding of Si-dice using Sn-3.5wt.%Ag (Journal of Electronic Materials (March 2008) 37:3 DOI: 10.1007/s11664-007-0341-z)",

author = "Kim, {Jung Mo} and Jung, {Jae Pil} and Zhou, {Y. Norman} and Kim, {Jong Hyeong}",

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AU - Kim, Jung Mo

AU - Jung, Jae Pil

AU - Zhou, Y. Norman

AU - Kim, Jong Hyeong

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IS - 8

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Erratum: Ambient temperature ultrasonic bonding of Si-dice using Sn-3.5wt.%Ag (Journal of Electronic Materials (March 2008) 37:3 DOI: 10.1007/s11664-007-0341-z)

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