@inproceedings{1b4dafa59ceb4d88ad062eb2d8f6797d,
title = "Eutectic Bonding in Sequential Bi and Sn Layers for Low-Temperature Interconnections",
abstract = "In the current study, low-temperature bonding of SAC 305 solder balls is achieved using electroplated Bi and Sn layers. The Bi and Sn interface initiates melting at the eutectic temperature, providing the opportunity to bond the electroplated layers with SAC 305 solder ball at 170°C. Compared to the conventional use of Sn58Bi solder paste, the current method allows for control over the quantity of bismuth within the solder joint. A nanocomposite solder ball is fabricated using ultrasonic melt treatment dispersion and disc punching technique. The hybrid bond formed with the nanocomposite solder ball displays higher shear strength, attributed to Bi-phase refinement and dispersion strengthening.",
keywords = "Bismuth, electroplating, Hybrid bonding, SAC 305, Shear Strength",
author = "Rajendran, {Sri Harini} and Jung, {Jae Pil} and Jung, {Chul Hwa} and Seo, {Seong Min}",
note = "Publisher Copyright: {\textcopyright} 2024 Japan Institute of Electronics Packaging.; 23rd International Conference on Electronics Packaging, ICEP 2024 ; Conference date: 17-04-2024 Through 20-04-2024",
year = "2024",
doi = "10.23919/ICEP61562.2024.10535706",
language = "English",
series = "2024 International Conference on Electronics Packaging, ICEP 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "277--278",
booktitle = "2024 International Conference on Electronics Packaging, ICEP 2024",
address = "United States",
}