@inproceedings{f3ce5c6234174aa3ac1ba8387ab105db,
title = "Evaluation of crack propagation at the interconnection interface induced by warpage of fan-out wafer-level-package",
abstract = "This study is to evaluate crack propagation possibility at the interconnection interface of FOWLP induced by warpage. The strain energy release rate (SERR) around the region of interests was calculated using Finite element (FE) analysis. The estimated SERR was compared with the measured critical SERR to predict the risk of the crack propagation at the interface. Moreover, a parametric study was performed to analyze the sensitivity of design parameters to define the most critical one affects crack propagation. This study may give ideas of delamination at the interconnection interface and the main parameter results in the failure induced by warpage of FOWLP.",
author = "Park, {Ah Young} and Lee, {Jae Hak} and Song, {Jun Yeob} and Kim, {Seung Man} and Seongheum Han",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 21st IEEE Electronics Packaging Technology Conference, EPTC 2019 ; Conference date: 04-12-2019 Through 06-12-2019",
year = "2019",
month = dec,
doi = "10.1109/EPTC47984.2019.9026606",
language = "English",
series = "2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "99--102",
booktitle = "2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019",
address = "United States",
}