TY - GEN
T1 - Evaluation of spreading thermal resistance for heat generating multi-electronic components
AU - Yun, Ho Kim
AU - Seo, Young Kim
AU - Gwang, Hoon Rhee
PY - 2006
Y1 - 2006
N2 - The Lee et al.'s equation has been widely used to predict spreading thermal resistance in a single, centered heat source and axi-symmetric condition. However, the eccentric and multiple heat sources are mounted on the base plate in many electronic applications. Thus, it is necessary to determine the spreading thermal resistance for multiple heat sources. For this purpose, we establish the correlation to predict spreading thermal resistance in this study. The correlation which transforms four heat sources to a single equivalent heat source is proposed and then the spreading thermal resistance can be obtained with the Lee et al.'s equation. When the four heat sources are mounted on a square base plate, the correlation is expressed as a function of the heat source size, the length of base plate, and the distance between heat sources. Compared to the results of three-dimensional numerical analysis, the spreading thermal resistance by the proposed correlation is in good agreement within 10 percent accuracy.
AB - The Lee et al.'s equation has been widely used to predict spreading thermal resistance in a single, centered heat source and axi-symmetric condition. However, the eccentric and multiple heat sources are mounted on the base plate in many electronic applications. Thus, it is necessary to determine the spreading thermal resistance for multiple heat sources. For this purpose, we establish the correlation to predict spreading thermal resistance in this study. The correlation which transforms four heat sources to a single equivalent heat source is proposed and then the spreading thermal resistance can be obtained with the Lee et al.'s equation. When the four heat sources are mounted on a square base plate, the correlation is expressed as a function of the heat source size, the length of base plate, and the distance between heat sources. Compared to the results of three-dimensional numerical analysis, the spreading thermal resistance by the proposed correlation is in good agreement within 10 percent accuracy.
KW - Correlation
KW - Geometric equivalence
KW - Multi-heat sources
KW - Numerical analysis
KW - Spreading thermal resistance
UR - http://www.scopus.com/inward/record.url?scp=33845563711&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2006.1645351
DO - 10.1109/ITHERM.2006.1645351
M3 - Conference contribution
AN - SCOPUS:33845563711
SN - 0780395247
SN - 9780780395244
T3 - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
SP - 258
EP - 264
BT - Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
T2 - 10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
Y2 - 30 May 2006 through 2 June 2006
ER -