Fabrication and characterization of (Bi,La)4Ti3O 12 films using LaAlO3 Buffer layers for MFIS structures

Byung Eun Park, Hiroshi Ishiwara

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Abstract

We formed MFIS (metal-ferroelectric-insulator-semiconductor) diodes by depositing Bi3.35La0.75Ti3O12 ferroelectric films and LaAlO3 buffer layers on Si(100) substrates. LaAlO3 films were prepared by an MBD (molecular beam deposition) method, and they were subjected to ex situ N2 annealing in RTA (rapid thermal annealing) furnace at 800°C for 1 min. On the optimized LaAlO 3/Si structure, a BLT film with 480 nm in thickness was deposited by a sol-gel technique. The memory window width in C-V (capacitance-voltage) curve of the Pt/BLT/LaAlO3/Si diode was about 4.5 V for voltage sweep of ±10 V. It was also found that the retention time of this diode was longer than 5 days.

Original languageEnglish
Pages (from-to)141-147
Number of pages7
JournalIntegrated Ferroelectrics
Volume62
DOIs
StatePublished - 2004

Keywords

  • (Bi,La)TiO
  • LaAlO
  • MBD
  • MFIS structure
  • Sol-gel

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