Abstract
We fabricated the n-channel metal-ferroelectric-insulator-semiconductor field-effect transistor (MFIS-FET) using an Au/(Bi,La) 4Ti 3O12/LaZrOx/Si(100) gate structure. We observed that the LaZrOx thin film had the equivalent oxide thickness value of around 8.7 nm. The 420-nm-thick (Bi,La) 4Ti3O 12 film on a LaZrOx/Si structure, showed a good ferroelectric property and had the width of the memory window of 1.2 V for a bias voltage sweeping of ±7 V. The drain current-gate voltage (I D-VG) of an Au/(Bi,La)4Ti3O 12/ LaZrOX/Si(100) MFIS-FET showed threshold voltage shift (memory window width) owing to the ferroelectric (Bi,La)4Ti 3O12 film. The drain current-drain voltage (I D-VG) characteristic curves exhibit typical n-channel field-effect transistor current-voltage characteristic. However, relatively large leakage current observed in the ID-VG and the I D-VG characteristic curves, might be caused by the high density of pores in the BLT film.
Original language | English |
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Pages (from-to) | 81-89 |
Number of pages | 9 |
Journal | Ferroelectrics |
Volume | 368 |
Issue number | 1 PART 2 |
DOIs | |
State | Published - 2008 |
Event | 11th European Meeting on Ferroelectricity, EMF-2007 - Bled, Slovenia Duration: 3 Sep 2007 → 7 Sep 2007 |
Keywords
- (Bi,La) TiO
- Ferroelectric memory
- LaZrO
- Metal-ferroelectric-insulator-silicon