Abstract
We fabricated a metal-ferroelectric-insulator-semiconductor structure using a poly(vinylidene fluoride trifluorethylene) as a ferroelectric layer and a cyanoethyl pullulan as an insulating buffer layer for the first time. The CEP thin films were deposited on Si substrate by using a sol-gel method. The coated P(VDF-TrFE) films on CEP/Si structure were crystallized. For the Au/P(VDF-TrFE)/CEP/Si structure, the capacitance-voltage characteristics showed hysteresis loops, the memory window width was about 4.6V at a bias sweep range of ±5V. The leakage current density was about 5.5 × 10-7 A/cm2 at 5V for the thick film from the 5 wt% solution.
Original language | English |
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Pages (from-to) | 25-31 |
Number of pages | 7 |
Journal | Ferroelectrics |
Volume | 484 |
Issue number | 1 |
DOIs | |
State | Published - 5 Aug 2015 |
Keywords
- CEP
- MFIS
- P(VDF-TrFE)
- ferroelectric