Fabrication of submicron size electrode via nonetching method for metal ion detection

A metal ion detector with a submicron size electrode was fabricated by atomic force microscopy lithography using a pre-programmed voltage and a nonetching method. The square frame of the mesa pattern was functionalized by (aminopropyl)triethoxysilane for the metal ion detection, and the remaining portion was used as an electrode by the self-assembly of (3-mercaptopropyl) trimethoxysialne for Au metal deposition. In this module, no metal lining or lead line was required, because the conductive tip (mobile electrode) was in direct contact with the gold-deposited mesa portion (fixed electrode). The conductance changed with the quantity of adsorbed copper ions, due to electron tunneling between the mobile and surface electrodes.