Femtosecond Laser-Assisted SiC Wafer Thinning Process

Hayoung Youn; Jaeseung Lim; Seongheum Han; Jae Hak Lee; Ah Young Park; Jun Yeob Song; Seungman Kim

Femtosecond Laser-Assisted SiC Wafer Thinning Process

Hayoung Youn, Jaeseung Lim, Seongheum Han, Jae Hak Lee, Ah Young Park, Jun Yeob Song, Seungman Kim

Department of Materials Science and Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract

Advancements in laser-based thinning techniques, utilizing ultrafast femtosecond lasers, have enabled precise and minimally damaging processing. Through laser processing and confirmation via Raman spectroscopy, the efficient thinning process has been validated.

Original language	English
State	Published - 2024
Event	2024 Conference on Lasers and Electro-Optics/Pacific Rim, CLEO-PR 2024 - Incheon, Korea, Republic of Duration: 4 Aug 2024 → 8 Aug 2024

Conference

Conference	2024 Conference on Lasers and Electro-Optics/Pacific Rim, CLEO-PR 2024
Country/Territory	Korea, Republic of
City	Incheon
Period	4/08/24 → 8/08/24

Cite this

@conference{654f777f0cd24f1ab91588de5c8afa28,

title = "Femtosecond Laser-Assisted SiC Wafer Thinning Process",

abstract = "Advancements in laser-based thinning techniques, utilizing ultrafast femtosecond lasers, have enabled precise and minimally damaging processing. Through laser processing and confirmation via Raman spectroscopy, the efficient thinning process has been validated.",

author = "Hayoung Youn and Jaeseung Lim and Seongheum Han and Lee, {Jae Hak} and Park, {Ah Young} and Song, {Jun Yeob} and Seungman Kim",

note = "Publisher Copyright: {\textcopyright} 2024 The Authors.; 2024 Conference on Lasers and Electro-Optics/Pacific Rim, CLEO-PR 2024 ; Conference date: 04-08-2024 Through 08-08-2024",

year = "2024",

language = "English",

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TY - CONF

T1 - Femtosecond Laser-Assisted SiC Wafer Thinning Process

AU - Youn, Hayoung

AU - Lim, Jaeseung

AU - Han, Seongheum

AU - Lee, Jae Hak

AU - Park, Ah Young

AU - Song, Jun Yeob

AU - Kim, Seungman

PY - 2024

Y1 - 2024

N2 - Advancements in laser-based thinning techniques, utilizing ultrafast femtosecond lasers, have enabled precise and minimally damaging processing. Through laser processing and confirmation via Raman spectroscopy, the efficient thinning process has been validated.

AB - Advancements in laser-based thinning techniques, utilizing ultrafast femtosecond lasers, have enabled precise and minimally damaging processing. Through laser processing and confirmation via Raman spectroscopy, the efficient thinning process has been validated.

UR - http://www.scopus.com/inward/record.url?scp=85216088204&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:85216088204

T2 - 2024 Conference on Lasers and Electro-Optics/Pacific Rim, CLEO-PR 2024

Y2 - 4 August 2024 through 8 August 2024

ER -

Femtosecond Laser-Assisted SiC Wafer Thinning Process

Abstract

Conference

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