Fluxless Sn-3.5 mass% Ag solder bump flip chip bonding by ultrasonic wave

Soon Min Hong, Choon Sik Kang, Jae Pil Jung

Research output: Contribution to journalArticlepeer-review

14 Scopus citations

Abstract

The ultrasonic solder bump flip chip bonding was investigated as a method of fluxless bonding. The 100 μm-diameter Sn-3.5 mass%Ag solder bumps were formed at 12 positions on a test Si-die by laser ball bonding process. The test flip chip dies were bonded to a TSM-coated glass substrate on a hotplate at different bonding loads and ultrasonic power condition. The die shear strength was evaluated and fracture surfaces were examined with SEM. The Sn-Ag solder flip chip bonding was possible at lower temperature than the melting point of Sn-3.5Ag solder. The die shear strength increased with increasing bonding temperature, bonding load, and ultrasonic power. However, at excessive bonding load condition over 0.8 N/bump, the die shear strength decreased. The bump height decreased with increasing bonding load.

Original languageEnglish
Pages (from-to)1336-1340
Number of pages5
JournalMaterials Transactions
Volume43
Issue number6
DOIs
StatePublished - Jun 2002

Keywords

  • Bump
  • Die shear strength
  • Flip chip bonding
  • Fluxless
  • Lead-free solder
  • Solder
  • Ultrasonic wave

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