Fluxless solder bumping in flip chip package by plasma reflow

Soon Min Hong, Choon Sik Kang, Jae Pil Jung

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

A new fluxless reflow process using Ar+10%H2 plasma was investigated for application to solder bump flip chip packaging. The 100 μm-diameter Sn-3.5wt%Ag solder balls were bonded to 250 μm pitch Cu/Ni under bump metallurgy (UBM) pattern by laser solder ball bumping method. Then, the Sn-Ag solder balls were reflowed in Ar+H2 plasma. Without flux, the wetting between solder and UBM occurred in Ar+H2 plasma. During plasma reflow, the solder bump reshaped and the crater on the top of bump disappeared. The bump shear strength increased as the Ni3Sn4 intermetallic compounds formed on initial reflow stage but began to degrease as coarse (Cu,Ni)6Sn5 grew at solder/UBM interface. As the plasma reflow time increased, the fracture within solder bulk decreased and the fracture along solder/UBM interface increased. The off-centered bumps self-aligned to UBM pattern during plasma reflow. The solder ball defect occurred in high power and a long time plasma reflow.

Original languageEnglish
Title of host publicationAdvances in Electronic Materials and Packaging 2001
EditorsS.B. Lee, K.W. Paik
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages139-144
Number of pages6
ISBN (Electronic)0780371577, 9780780371576
DOIs
StatePublished - 2001
Event3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of
Duration: 19 Nov 200122 Nov 2001

Publication series

NameAdvances in Electronic Materials and Packaging 2001

Conference

Conference3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
Country/TerritoryKorea, Republic of
CityJeju Island
Period19/11/0122/11/01

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