Fluxless wetting properties of top surface metallurgy in different Pb-free solders

S. M. Hong, J. Y. Park, J. P. Jung, C. S. Kang

Research output: Contribution to journalArticlepeer-review

1 Scopus citations


The fluxless wetting properties were evaluated for TSM (Top Surface Metallurgy)-coated glass substrate by wetting balance method. The wettability of TSM was estimated with new indices from the wetting curve for one side-coated specimen. For TSM, it was more effective to use Cu as a wetting layer with Au as a protection layer than to use Au as a wetting layer alone. The degree of wetting of Sn-5Sb and Sn-57Bi solder was better than that of Sn-37Pb and Sn-3.5Ag solder. However, the wetting rate of Sn-37Pb solder was higher than those of Pb-free solders. The wetting angle of TSM-coated glass substrate to solders could be calculated from the force balance equation by measuring static state force and tilt angle. The wetting angles of Cr/Cu/Au TSM to Sn-37Pb, Sn-3.5Ag, Sn-5Sb and Sn-57Bi were 69.4°, 67.2°, 60.1° and 53.0°, respectively.

Original languageEnglish
Pages (from-to)1423-1427
Number of pages5
JournalMaterials Transactions
Issue number7
StatePublished - 2001


  • Flip chip
  • Lead-free solder
  • Top surface metallurgy
  • Wettability
  • Wetting balance test


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