Abstract
The fluxless wetting properties were evaluated for TSM (Top Surface Metallurgy)-coated glass substrate by wetting balance method. The wettability of TSM was estimated with new indices from the wetting curve for one side-coated specimen. For TSM, it was more effective to use Cu as a wetting layer with Au as a protection layer than to use Au as a wetting layer alone. The degree of wetting of Sn-5Sb and Sn-57Bi solder was better than that of Sn-37Pb and Sn-3.5Ag solder. However, the wetting rate of Sn-37Pb solder was higher than those of Pb-free solders. The wetting angle of TSM-coated glass substrate to solders could be calculated from the force balance equation by measuring static state force and tilt angle. The wetting angles of Cr/Cu/Au TSM to Sn-37Pb, Sn-3.5Ag, Sn-5Sb and Sn-57Bi were 69.4°, 67.2°, 60.1° and 53.0°, respectively.
Original language | English |
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Pages (from-to) | 1423-1427 |
Number of pages | 5 |
Journal | Materials Transactions |
Volume | 42 |
Issue number | 7 |
DOIs | |
State | Published - 2001 |
Keywords
- Flip chip
- Lead-free solder
- Top surface metallurgy
- Wettability
- Wetting balance test