Fluxless wetting properties of UBM-coated Si-wafer to Sn-3.5wt% Ag solder

Soon Min Hong; Jae Yong Park; Choon Sik Kang; Jae Pil Jung

doi:10.1109/TADVP.2002.807622

Fluxless wetting properties of UBM-coated Si-wafer to Sn-3.5wt% Ag solder

Soon Min Hong, Jae Yong Park, Choon Sik Kang, Jae Pil Jung

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

Abstract

The fluxless wetting properties of Under Bump Metallurgy (UBM)-coated Si-wafer to Sn-37wt%Pb and Sn-3.5wt%Ag solder were estimated by wetting balance method. With wettability indices from the wetting curves of one-side-coated specimens, the degree and rate of wetting of different UBM structure were evaluated. Wettability of Au/Cu/Cr and Au/Ni/Ti UBM shows similar results in terms of the degree of wetting while the wetting rate of Au/Cu/Cr is better than that of Au/Ni/Ti. Related with the thickness of Cu layer in Au/Cu/Cr UBM, wettability of 0.1 μm-thick Cu film is superior to that of 0.5 μm-thick one from the viewpoint of the degree of wetting but the effect of the Cu layer thickness on wetting kinetics is negligible. Using flux has advantage over Au coating not so much in the rate of wetting as in the degree of wetting. The degree and the rate of wetting of nickel base UBM is better in Sn-Ag solder than in Sn-Pb solder.

Original language	English
Pages (from-to)	255-261
Number of pages	7
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	26
Issue number	1
DOIs	https://doi.org/10.1109/TADVP.2002.807622
State	Published - Mar 2003

Keywords

Fluxless soldering
Pb-free solder
Under bump metallurgy
Wettability
Wetting balance test

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10.1109/TADVP.2002.807622

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title = "Fluxless wetting properties of UBM-coated Si-wafer to Sn-3.5wt% Ag solder",

abstract = "The fluxless wetting properties of Under Bump Metallurgy (UBM)-coated Si-wafer to Sn-37wt%Pb and Sn-3.5wt%Ag solder were estimated by wetting balance method. With wettability indices from the wetting curves of one-side-coated specimens, the degree and rate of wetting of different UBM structure were evaluated. Wettability of Au/Cu/Cr and Au/Ni/Ti UBM shows similar results in terms of the degree of wetting while the wetting rate of Au/Cu/Cr is better than that of Au/Ni/Ti. Related with the thickness of Cu layer in Au/Cu/Cr UBM, wettability of 0.1 μm-thick Cu film is superior to that of 0.5 μm-thick one from the viewpoint of the degree of wetting but the effect of the Cu layer thickness on wetting kinetics is negligible. Using flux has advantage over Au coating not so much in the rate of wetting as in the degree of wetting. The degree and the rate of wetting of nickel base UBM is better in Sn-Ag solder than in Sn-Pb solder.",

keywords = "Fluxless soldering, Pb-free solder, Under bump metallurgy, Wettability, Wetting balance test",

author = "Hong, {Soon Min} and Park, {Jae Yong} and Kang, {Choon Sik} and Jung, {Jae Pil}",

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AU - Park, Jae Yong

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AU - Jung, Jae Pil

PY - 2003/3

Y1 - 2003/3

N2 - The fluxless wetting properties of Under Bump Metallurgy (UBM)-coated Si-wafer to Sn-37wt%Pb and Sn-3.5wt%Ag solder were estimated by wetting balance method. With wettability indices from the wetting curves of one-side-coated specimens, the degree and rate of wetting of different UBM structure were evaluated. Wettability of Au/Cu/Cr and Au/Ni/Ti UBM shows similar results in terms of the degree of wetting while the wetting rate of Au/Cu/Cr is better than that of Au/Ni/Ti. Related with the thickness of Cu layer in Au/Cu/Cr UBM, wettability of 0.1 μm-thick Cu film is superior to that of 0.5 μm-thick one from the viewpoint of the degree of wetting but the effect of the Cu layer thickness on wetting kinetics is negligible. Using flux has advantage over Au coating not so much in the rate of wetting as in the degree of wetting. The degree and the rate of wetting of nickel base UBM is better in Sn-Ag solder than in Sn-Pb solder.

AB - The fluxless wetting properties of Under Bump Metallurgy (UBM)-coated Si-wafer to Sn-37wt%Pb and Sn-3.5wt%Ag solder were estimated by wetting balance method. With wettability indices from the wetting curves of one-side-coated specimens, the degree and rate of wetting of different UBM structure were evaluated. Wettability of Au/Cu/Cr and Au/Ni/Ti UBM shows similar results in terms of the degree of wetting while the wetting rate of Au/Cu/Cr is better than that of Au/Ni/Ti. Related with the thickness of Cu layer in Au/Cu/Cr UBM, wettability of 0.1 μm-thick Cu film is superior to that of 0.5 μm-thick one from the viewpoint of the degree of wetting but the effect of the Cu layer thickness on wetting kinetics is negligible. Using flux has advantage over Au coating not so much in the rate of wetting as in the degree of wetting. The degree and the rate of wetting of nickel base UBM is better in Sn-Ag solder than in Sn-Pb solder.

KW - Fluxless soldering

KW - Pb-free solder

KW - Under bump metallurgy

KW - Wettability

KW - Wetting balance test

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Fluxless wetting properties of UBM-coated Si-wafer to Sn-3.5wt% Ag solder

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