Abstract
The degradation of the fin-type buried-channel-array transistor (BCAT) in dynamic random access memory (DRAM) cell is investigated under Fowler-Nordheim stress at various temperatures, including 77 K. While the increase in the OFF current is dominated by the Shockley-Read-Hall junction leakage, the threshold voltage shift (Δ VT) comprises a positive component due to the interface trap generation and a negative component resulting from the electric field concentration-induced charge trapping into the gate insulator bulk, with respective activation energies of 0.22 and 0.13 eV. Furthermore, based on the consistency between the experimentally decomposed Δ VT components and the simulated ones, it is found that the anode hole injection dominates the degradations of the wordline-active operation and refresh time in cryogenic DRAM.
Original language | English |
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Pages (from-to) | 48-52 |
Number of pages | 5 |
Journal | IEEE Transactions on Electron Devices |
Volume | 70 |
Issue number | 1 |
DOIs | |
State | Published - 1 Jan 2023 |
Keywords
- Anode hole injection
- Fowler Nordheim (FN) stress
- buried-channel-array transistor (BCAT)
- cryogenic
- dynamic random access memory (DRAM) cell
- hole trapping
- interface trap