Full software analysis and impedance matching of radio frequency CMOS integrated circuits

Ki Hyuk Kim; Hoi Ju Chung; Sung Ho Yoon; Sung Woo Hwang; Jinwoo Park; Soo Won Kim; Joongho Choi; Doyeol Ahn

doi:10.1109/6144.833059

Full software analysis and impedance matching of radio frequency CMOS integrated circuits

Ki Hyuk Kim, Hoi Ju Chung, Sung Ho Yoon, Sung Woo Hwang, Jinwoo Park, Soo Won Kim, Joongho Choi, Doyeol Ahn

School of Electrical and Computer Engineering

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.

Original language	English
Pages (from-to)	183-189
Number of pages	7
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	23
Issue number	1
DOIs	https://doi.org/10.1109/6144.833059
State	Published - 2000

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abstract = "We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.",

author = "Kim, {Ki Hyuk} and Chung, {Hoi Ju} and Yoon, {Sung Ho} and Hwang, {Sung Woo} and Jinwoo Park and Kim, {Soo Won} and Joongho Choi and Doyeol Ahn",

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AU - Kim, Ki Hyuk

AU - Chung, Hoi Ju

AU - Yoon, Sung Ho

AU - Hwang, Sung Woo

AU - Park, Jinwoo

AU - Kim, Soo Won

AU - Choi, Joongho

AU - Ahn, Doyeol

PY - 2000

Y1 - 2000

N2 - We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.

AB - We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.

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DO - 10.1109/6144.833059

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EP - 189

JO - IEEE Transactions on Components and Packaging Technologies

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IS - 1

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Full software analysis and impedance matching of radio frequency CMOS integrated circuits

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