High shear speed characteristics of sub-100 mm low alpha sac105 solder bump directly fabricated on cu filled through si via for 3d integration

Do Hyun Jung, Shalu Agarwal, Santosh Kumar, Jae Pil Jung

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Fingerprint

Dive into the research topics of 'High shear speed characteristics of sub-100 mm low alpha sac105 solder bump directly fabricated on cu filled through si via for 3d integration'. Together they form a unique fingerprint.

Engineering

Material Science