Abstract
Thin-film transistor liquid crystal display (TFT-LCD) panels of a high transmittance structure were fabricated by using a low-k dielectric film as a passivation layer. The low-dielectric films were successfully deposited and patterned using a conventional plasma-enhanced chemical vapor deposition (PECVD) and plasma-assisted etching techniques. The interface between the a-Si channel and the overlaying passivation was modified by appropriate plasma treatment prior to the low-k deposition. TFTs having the a-Si:C:O:H passivation showed a transfer characteristics similar to that of conventional TFTs. The high transmittance panel showed brightness approximately 30% higher than that of a standard panel without degrading other display characteristics, such as crosstalk.
Original language | English |
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Pages (from-to) | 381-383 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 25 |
Issue number | 6 |
DOIs | |
State | Published - Jun 2004 |
Keywords
- Aperture ratio
- Dielectric constant
- Passivation
- TFT-LCD