Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn-Ag-Cu alloy

Ashutosh Sharma, B. G. Baek, Jae Pil Jung

Research output: Contribution to journalArticlepeer-review

71 Scopus citations

Abstract

In this study, the effect of La2O3 nanoparticles (0, 0.01, 0.03, 0.05 and 0.1wt.%) has been investigated in Sn-3.0Ag-0.5Cu (SAC-305) alloy. The various soldering properties have been tested, such as wettability, microstructural evolution, intermetallic compound formation, micro-hardness, tensile strength, and fracture analysis of tensile tested samples. La2O3 nanoparticles are added in the Sn-3.0Ag-0.5Cu alloy by mechanical mixing of powders and melting. The structural and morphological features of the samples are characterized by X-ray diffraction (XRD), scanning electron microscope (SEM), and electron probe micro-analyzer (EPMA). The experimental results indicate that the best combination of microstructural, wetting and tensile properties is obtained at 0.05wt.% La2O3 in the solder matrix. The sample reinforced with 0.05wt.% La2O3 i.e. SAC-0.05 La2O3 exhibits ~18% increase in microhardness, ~26% increase in the ultimate tensile strength (UTS), and ~14% elongation due to the adsorption of high surface energy of La2O3 nanoparticles in the matrix.

Original languageEnglish
Pages (from-to)370-379
Number of pages10
JournalMaterials and Design
Volume87
DOIs
StatePublished - 15 Dec 2015

Keywords

  • Composite
  • Lead free
  • Microstructure
  • Nanoparticle
  • Tensile
  • Wettability

Fingerprint

Dive into the research topics of 'Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn-Ag-Cu alloy'. Together they form a unique fingerprint.

Cite this